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TPA6138A2 Arkusz danych(PDF) 4 Page - Texas Instruments

Numer części TPA6138A2
Szczegółowy opis  DirectPath Headphone Driver With Adjustable Gain
Download  22 Pages
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Strona internetowa  http://www.ti.com
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TPA6138A2
SLOS704B – JANUARY 2011 – REVISED AUGUST 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD to GND
–0.3
4
V
Input voltage, VI
VSS – 0.3
VDD + 0.3
V
Minimum load impedance – line outputs – OUTL, OUTR
12.8
Mute to GND, UVP to GND
–0.3
VDD +0.3
V
Maximum operating junction temperature range, TJ
–40
150
°C
Storage temperature range, Tstg
–40
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±4000
Electrostatic
V(ESD)
V
discharge
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
VDD
Power supply
DC supply voltage
3
3.3
3.6
V
RL
Load impedance
16
32
Ω
VIL
Low-level input voltage
Mute
40
%VDD
VIH
High-level input voltage
Mute
60
%VDD
TA
Ambient temperature
–40
25
85
°C
7.4 Thermal Information
TPA6138A2
THERMAL METRIC(1)
PW (TSSOP)
UNIT
14 PINS
RθJA
Junction-to-ambient thermal resistance
130
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
49
°C/W
RθJB
Junction-to-board thermal resistance
63
°C/W
ψJT
Junction-to-top characterization parameter
3.6
°C/W
ψJB
Junction-to-board characterization parameter
62
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: TPA6138A2


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