4

TMP464

SBOS835 – MAY 2017

www.ti.com

Product Folder Links: TMP464

Submit Documentation Feedback

Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply

V+

–0.3

6

V

Input voltage

THERM, THERM2, SDA, SCL, and ADD only

–0.3

6

V

D1+ through D4+

–0.3

((V+) + 0.3)

and

≤ 6

D– only

–0.3

0.3

Input current

SDA sink

–25

mA

All other pins

–10

10

Operating temperature

–55

150

°C

150

°C

–60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V+

Supply voltage

1.7

3.6

V

Operating free-air temperature

–40

125

°C

Remote junction temperature

–55

150

°C

6.4 Thermal Information

THERMAL METRIC

TMP464

UNIT

RGT (QFN)

16 PINS

Junction-to-ambient thermal resistance

46

°C/W

Junction-to-case (top) thermal resistance

43

°C/W

Junction-to-board thermal resistance

17

°C/W

Junction-to-top characterization parameter

0.8

°C/W

Junction-to-board characterization parameter

5

°C/W