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Product data sheet

Rev. 02 — 10 September 2004

3 of 12

Philips Semiconductors

BAS16VV; BAS16VY

Triple high-speed switching diodes

[1]

[2]

Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.

[3]

Single diode loaded.

[4]

Solder points at pins 2, 3, 5 and 6.

6.

Thermal characteristics

[1]

Refer to SOT666 standard mounting conditions.

[2]

Reflow soldering is the only recommended soldering method.

[3]

pad.

[4]

Solder points at pins 2, 3, 5 and 6.

non-repetitive peak forward

current

square wave

[1] -

-

4.5

A

-

1

A

-

0.5

A

total power dissipation

SOT666

[2] [3] -

180

mW

SOT363

[4] -

250

mW

junction temperature

-

150

°C

ambient temperature

−65

+150

°C

storage temperature

−65

+150

°C

Table 6:

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 7:

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction

to ambient

in free air

SOT666

[1] [2] -

-

700

K/W

[2] [3] -

-

410

K/W

thermal resistance from junction

to soldering point

SOT363

[4] -

-

260

K/W