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CSD18511KTT Arkusz danych(PDF) 9 Page - Texas Instruments |
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CSD18511KTT Arkusz danych(HTML) 9 Page - Texas Instruments |
9 / 11 page 42X (0.97) 42X (0.95) (1.17) TYP (1.15) TYP (0.48) TYP (6.9) (5.08) (R ) TYP 0.05 2X (3.82) 2X (1.05) SYMM PKG 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND (7.48) (8.55) 2X (3.82) 2X (1.05) (3.4) (6.9) (5.08) (R ) TYP 0.05 PKG SYMM PKG OPENING SOLDER MASK METAL NON SOLDER MASK DEFINED SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED 9 CSD18511KTT www.ti.com SLPS684 – JULY 2017 Product Folder Links: CSD18511KTT Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated 7.2 Recommended PCB Pattern For recommended circuit layout for PCB designs, see Reducing Ringing Through PCB Layout Techniques (SLPA005). 7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness) Notes: 1. This package is designed to be soldered to a thermal pad on the board. See PowerPAD™ Thermally Enhanced Package (SLMA002) and PowerPAD™ Made Easy (SLMA004) for more information. 2. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 3. Board assembly site may have different recommendations for stencil design. |
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