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LM3253 Arkusz danych(PDF) 4 Page - Texas Instruments

Numer części LM3253
Szczegółowy opis  High-Current Step-Down Converter for 2G/3G/4G RF Power Amplifiers
Download  26 Pages
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

LM3253 Arkusz danych(HTML) 4 Page - Texas Instruments

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LM3253
SNVS791Q – FEBRUARY 2012 – REVISED MAY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
(1) (2) (3)
VDD, PVIN to SGND
−0.2V to +6.0V
PGND to SGND
−0.2V to +0.2V
EN, FB, VCON, BP, MODE
(SGND
−0.2V) to (VDD +0.2V)
SW, ACB
(PGND
−0.2V) to (PVIN +0.2V
PVIN to VDD
−0.2V to +0.2V
Continuous Power Dissipation(4)
Internally Limited
Junction Temperature (TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
Maximum Lead Temperature
+260°C
(Soldering, 10 sec)
ESD Rating(5)(6)
Human Body Model
2kV
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pins. The LM3253 is designed for mobile phone applications where turn-on after
power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal
Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin LOW until the input voltage
exceeds 2.7V.
(3)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and
disengages at TJ = 130°C (typ.).
(5)
The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. (MIL-STD-883 3015.7) The machine
model is a 200 pF capacitor discharged directly into each pin.
(6)
Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD
handling procedures can result in damage.
4
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Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: LM3253


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