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AD9262BCPZ-10 Arkusz danych(PDF) 9 Page - Analog Devices

Numer części AD9262BCPZ-10
Szczegółowy opis  30 MSPS to 160 MSPS Dual Continuous Time Sigma-Delta ADC
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Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
Logo AD - Analog Devices

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AD9262
Rev. A | Page 8 of 32
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
−0.3 V to +2.0 V
DVDD to DGND
−0.3 V to +2.0 V
DRVDD to DGND
−0.3 V to +3.9 V
AGND to DGND
−0.3 V to +0.3 V
AVDD to DRVDD
−3.9 V to +2.0 V
CVDD to CGND
−0.3 V to +2.0 V
CGND to DGND
−0.3 V to +0.3 V
D0A to D15A to DGND
−0.3 V to +2.0 V
D0B to D15B to DGND
−0.3 V to +2.0 V
DCO to DGND
−0.3 V to +2.0 V
ORA, ORB to DGND
−0.3 V to +2.0 V
SDIO to DGND
−0.3 V to +3.9 V
CSB to AGND
−0.3 V to +3.9 V
SCLK to AGND
−0.3 V to +3.9 V
VIN+A/VIN−A, VIN+B/VIN−B to AGND
−0.3 V to +2.5 V
CLK+, CLK− to CGND
−0.3 V to +2.0 V
Environmental
Storage Temperature Range
−65°C to +125°C
Operating Temperature Range
−40°C to +85°C
Lead Temperature (Soldering, 10 Sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 7. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LFCSP (CP-64-4)
21.2
1.1
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
ESD CAUTION


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