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SI5463EDC-T1 Arkusz danych(PDF) 1 Page - Vishay Siliconix |
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SI5463EDC-T1 Arkusz danych(HTML) 1 Page - Vishay Siliconix |
1 / 5 page Si5463EDC Vishay Siliconix Document Number: 71364 S-21251—Rev. C, 05-Aug-02 www.vishay.com 2-1 P-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (Ω) ID (A) 0.062 @ VGS =--4.5 V --5.1 20 0.068@ VGS =--3.6 V --4.9 --20 0.085 @ VGS =--2.5 V --4.4 0.120 @ VGS =--1.8 V --3.7 1206-8 ChipFETt D D D G D D D S 1 Bottom View Marking Code LB XX Lot Traceability and Date Code Part # Code S 5.4 kΩ D P-Channel MOSFET G Ordering Information: Si5463EDC-T1 ABSOLUTE MAXIMUM RATINGS (TA =25_C UNLESS OTHERWISE NOTED) Parameter Symbol 5 secs Steady State Unit Drain-Source Voltage VDS --20 V Gate-Source Voltage VGS 12 V Continuous Drain Current (TJ = 150_C)a TA =25_C ID --5.1 --3.8 Continuous Drain Current (TJ = 150_C)a TA =85_C ID --3.7 --2.7 A Pulsed Drain Current IDM --15 A Continuous Source Currenta IS --1.9 --1.0 Maximum Power Dissipationa TA =25_C PD 2.3 1.25 W Maximum Power Dissipationa TA =85_C PD 1.2 0.65 W Operating Junction and Storage Temperature Range TJ,Tstg --55 to 150 _ C Soldering Recommendations (Peak Temperature)c, d 260 _ C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit M i J ti t A bi ta t ≤ 5sec R 45 55 Maximum Junction-to-Ambienta Steady State RthJA 84 100 _ C/W Maximum Junction-to-Foot (Drain) Steady State RthJF 20 25 C/ Notes a. Surface Mounted on 1” x 1” FR4 Board. b. When using HBM. The MM rating is 300 V c. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singula- tion process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder inter- connection. d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. |
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