AD7142_17 datasheet(37/70 Pages) AD

Numer części	AD7142

Szczegółowy opis	Programmable Controller for Capacitance Touch Sensors

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37 / 70 page

Data Sheet

AD7142

Rev. B | Page 37 of 70

PCB DESIGN GUIDELINES

CAPACITIVE SENSOR BOARD MECHANICAL SPECIFICATIONS

Table 19.

Parameter

Symbol

Min

Typ

Max

Unit

Distance from Edge of Any Sensor to Edge of Grounded Metal Object

D1

0.1

mm

Distance Between Sensor Edges1

D2 = D3 = D4

0

mm

Distance Between Bottom of Sensor Board and Controller Board or Grounded

Metal Casing2

D5

1.0

mm

1

The distance is dependent on the application and the positioning of the switches relative to each other and with respect to the user’s finger positioning and handling.

Adjacent sensors, with 0 minimum space between them, are implemented differentially.

2

The 1.0 mm specification is meant to prevent direct sensor board contact with any conductive material. This specification does not guarantee no EMI coupling from

the controller board to the sensors. Address potential EMI coupling issues by placing a grounded metal shield between the capacitive sensor board and the main

controller board as shown in Figure 55.

SLIDER

BUTTONS

CAPACITIVE SENSOR

PRINTED CIRCUIT

D1

D3

D4

8-WAY

SWITCH

METAL OBJECT

D2

Figure 53. Capacitive Sensor Board Mechanicals Top View

D5

CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING

CAPACITIVE SENSOR BOARD

Figure 54. Capacitive Sensor Board Mechanicals Side View

CAPACITIVE SENSOR BOARD

D5

CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING

GROUNDED METAL SHIELD

Figure 55. Capacitive Sensor Board with Grounded Shield

CHIP SCALE PACKAGES

The lands on the chip scale package (CP-32-3) are rectangular.

The printed circuit board pad for these must be 0.1 mm longer

than the package land length, and 0.05 mm wider than the

package land width. Center the land on the pad to maximize the

solder joint size.

The bottom of the chip scale package has a central thermal pad.

The thermal pad on the printed circuit board must be at least as

large as this exposed pad. To avoid shorting, provide a clearance

of at least 0.25 mm between the thermal pad and the inner

edges of the land pattern on the printed circuit board.

Thermal vias can be used on the printed circuit board thermal

pad to improve thermal performance of the package. If vias are

used, they must be incorporated in the thermal pad at a 1.2 mm

pitch grid. The via diameter must be between 0.3 mm and

0.33 mm, and the via barrel must be plated with 1 oz. copper to

plug the via.

Connect the printed circuit board thermal pad to GND.

Podobny numer części - AD7142_17

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