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AD7879-1ACBZ-500R7 Arkusz danych(PDF) 6 Page - Analog Devices |
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AD7879-1ACBZ-500R7 Arkusz danych(HTML) 6 Page - Analog Devices |
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6 / 40 page  AD7879/AD7889 Data Sheet Rev. D | Page 6 of 40 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter Rating VCC to GND −0.3 V to +3.6 V Analog Input Voltage to GND −0.3 V to VCC + 0.3 V AUX/VBAT to GND −0.3 V to +5 V Digital Input Voltage to GND −0.3 V to VCC + 0.3 V Digital Output Voltage to GND −0.3 V to VCC + 0.3 V Input Current to Any Pin Except Supplies1 10 mA ESD Rating (X+, Y+, X−, Y−) Air Discharge Human Body Model 15 kV Contact Human Body Model 10 kV ESD Rating (All Other Pins) Human Body Discharge 4 kV Field-Induced Charged Device Model 1 kV Machine Model 0.2 kV Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Power Dissipation WLCSP (4-Layer Board) 866 mW LFCSP (4-Layer Board) 2.138 W IR Reflow Peak Temperature 260°C (±0.5°C) Lead Temperature (Soldering 10 sec) 300°C 1 Transient currents of up to 100 mA do not cause SCR latch-up. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 5. Thermal Resistance Package Type1 θJA Unit 12-Ball WLCSP 75 °C/W 16-Lead LFCSP 30.4 °C/W 1 4-layer board. 200µA IOL 200µA IOH 1.4V TO OUTPUT PIN CL 50pF Figure 4. Circuit Used for Digital Timing ESD CAUTION |
Podobny numer części - AD7879-1ACBZ-500R7 |
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Podobny opis - AD7879-1ACBZ-500R7 |
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