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ADG902BRM-REEL7 Arkusz danych(PDF) 3 Page - Analog Devices

Numer części ADG902BRM-REEL7
Szczegółowy opis  Wideband, 40 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, SPST Switches
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ADG902BRM-REEL7 Arkusz danych(HTML) 3 Page - Analog Devices

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REV. A
ADG901/ADG902
–3–
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4 V
Inputs to GND . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.3 V
2
Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
MSOP Package
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 206
°C/W
LFCSP Package
JA Thermal Impedance (2-layer board) . . . . . . . . . . 84
°C/W
JA Thermal Impedance (4-layer board) . . . . . . . . . . 48
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235
°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2 RF1/2 Off Port Inputs to Ground ................................... –0.5 V to V
DD – 0.5 V
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Branding
ADG901BRM
–40
°C to +85°CMini Small Outline Package (MSOP)
RM-8
W6B
ADG901BRM-500RL7
–40
°C to +85°CMini Small Outline Package (MSOP)
RM-8
W6B
ADG901BRM-REEL7
–40
°C to +85°CMini Small Outline Package (MSOP)
RM-8
W6B
ADG901BCP-500RL7
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-8
W6B
ADG901BCP-REEL7
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-8
W6B
ADG902BRM
–40
°C to +85°CMini Small Outline Package (MSOP)
RM-8
W7B
ADG902BRM-500RL7
–40
°C to +85°CMini Small Outline Package (MSOP)
RM-8
W7B
ADG902BRM-REEL7
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
RM-8
W7B
ADG902BCP-500RL7
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-8
W7B
ADG902BCP-REEL7
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-8
W7B
EVAL-ADG901EB
Evaluation Board
EVAL-ADG902EB
Evaluation Board
Table I. Truth Table
CTRL
Signal Path
0
RF1 isolated from RF2
1
RF1 to RF2
PIN CONFIGURATION
8-Lead MSOP (RM-8)
8-Lead 3 mm
3 mm LFCSP (CP-8)
TOP VIEW
(Not to Scale)
1
VDD
CTRL
GND
RF1
ADG901/
ADG902
GND
GND
RF2
GND
2
3
4
8
7
6
5
PIN FUNCTION DESCRIPTIONS
Pin No.
Mnemonic
Function
1VDD
Power Supply Input. These parts can
be operated from 1.65 V to 2.75 V;
VDD should be decoupled to GND.
2
CTRL
CMOS or TTL Logic Level.
0
➞ RF1 Isolated from RF2
1
➞ RF1 to RF2
3, 5, 6, 7
GND
Ground Reference Point for All
Circuitry on the Part.
4
RF1
RF1 Port.
8
RF2
RF2 Port.


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