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LM34DH Arkusz danych(PDF) 2 Page - National Semiconductor (TI) |
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LM34DH Arkusz danych(HTML) 2 Page - National Semiconductor (TI) |
2 / 10 page Absolute Maximum Ratings (Note 10) If MilitaryAerospace specified devices are required please contact the National Semiconductor Sales OfficeDistributors for availability and specifications Supply Voltage a 35V to b02V Output Voltage a 6V to b10V Output Current 10 mA Storage Temperature TO-46 Package b 76 Fto a356 F TO-92 Package b 76 Fto a300 F SO-8 Package b 65 Cto a150 C ESD Susceptibility (Note 11) 800V Lead Temp TO-46 Package (Soldering 10 seconds) a 300 C TO-92 Package (Soldering 10 seconds) a 260 C SO Package (Note 12) Vapor Phase (60 seconds) 215 C Infrared (15 seconds) 220 C Specified Operating Temp Range (Note 2) TMIN to TMAX LM34 LM34A b 50 Fto a300 F LM34C LM34CA b 40 Fto a230 F LM34D a 32 Fto a212 F DC Electrical Characteristics (Note 1 Note 6) LM34A LM34CA Parameter Conditions Tested Design Tested Design Units Typical Limit Limit Typical Limit Limit (Max) (Note 4) (Note 5) (Note 4) (Note 5) Accuracy (Note 7) TA ea77 F g 04 g 10 g 04 g 10 F TA e 0 F g 06 g 06 g 20 F TA e TMAX g 08 g 20 g 08 g 20 F TA e TMIN g 08 g 20 g 08 g 30 F Nonlinearity (Note 8) TMIN s TA s TMAX g 035 g 07 g 030 g 06 F Sensor Gain TMIN s TA s TMAX a 100 a 99 a 100 a 99 mV F min (Average Slope) a 101 a 101 mV F max Load Regulation TA ea77 F g 04 g 10 g 04 g 10 mVmA (Note 3) TMIN s TA s TMAX g 05 g 30 g 05 g 30 mVmA 0 s IL s 1mA Line Regulation (Note 3) TA ea77 F g 001 g 005 g 001 g 005 mVV 5V s VS s 30V g 002 g 01 g 002 g 01 mVV Quiescent Current VS ea5V a77 F75 90 75 90 m A (Note 9) VS ea5V 131 160 116 139 m A VS ea30V a77 F76 92 76 92 m A VS ea30V 132 163 117 142 m A Change of Quiescent 4V s VS s 30V a77 F a 05 20 05 20 m A Current (Note 3) 5V s VS s 30V a 10 30 10 30 m A Temperature Coefficient a 030 a 05 a 030 a 05 m A F of Quiescent Current Minimum Temperature In circuit of Figure 1 a 30 a 50 a 30 a 50 F for Rated Accuracy IL e 0 Long-Term Stability Tj e TMAX for 1000 hours g 016 g 016 F Note 1 Unless otherwise noted these specifications apply b50 F s Tj s a 300 F for the LM34 and LM34A b40 F s Tj s a230 F for the LM34C and LM34CA and a32 F s Tj s a 212 F for the LM34D VS ea5 Vdc and ILOAD e 50 mA in the circuit of Figure 2 a6 Vdc for LM34 and LM34A for 230 F s Tj s 300 F These specifications also apply from a5 FtoTMAX in the circuit of Figure 1 Note 2 Thermal resistance of the TO-46 package is 720 FW junction to ambient and 43 FW junction to case Thermal resistance of the TO-92 package is 324 FW junction to ambient Thermal resistance of the small outline molded package is 400 FW junction to ambient For additional thermal resistance informa- tion see table in the Typical Applications section Note 3 Regulation is measured at constant junction temperature using pulse testing with a low duty cycle Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance Note 4 Tested limits are guaranteed and 100% tested in production Note 5 Design limits are guaranteed (but not 100% production tested) over the indicated temperature and supply voltage ranges These limits are not used to calculate outgoing quality levels Note 6 Specification in BOLDFACE TYPE apply over the full rated temperature range Note 7 Accuracy is defined as the error between the output voltage and 10 mV F times the device’s case temperature at specified conditions of voltage current and temperature (expressed in F) Note 8 Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the device’s rated temperature range Note 9 Quiescent current is defined in the circuit of Figure 1 Note 10 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions (see Note 1) Note 11 Human body model 100 pF discharged through a 15 kX resistor Note 12 See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ or the section titled ‘‘Surface Mount’’ found in a current National Semiconductor Linear Data Book for other methods of soldering surface mount devices 2 |
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