AD7610

Data Sheet

Rev. A | Page 10 of 32

Pin No.

Mnemonic

Type1

Description

27

D14 or

DI/O

In parallel mode, this output is used as Bit 14 of the parallel port data output bus.

SCCLK

Serial Configuration Clock. In serial software configuration mode (SER/PAR = high, HW/SW = low) this input is

used to clock in the data on SCIN. The active edge where the data SCIN is updated depends on the logic state

of the INVSCLK pin. See the

Software Configuration section.

28

D15 or

DI/O

In parallel mode, this output is used as Bit 15 of the parallel port data output bus.

SCCS

Serial Configuration Chip Select. In serial software configuration mode (SER/PAR = high, HW/SW = low) this

input enables the serial configuration port. See the

Software Configuration section.

29

BUSY

DO

Busy Output. Transitions high when a conversion is started, and remains high until the conversion

is complete and the data is latched into the on-chip shift register. The falling edge of BUSY can be

used as a data ready clock signal. Note that in master read after convert mode (SER/PAR = high, EXT/INT = low,

RDC = low) the busy time changes according to

Table 4.

30

TEN

DI2

Input Range Select. Used in conjunction with BIPOLAR per the following:

Input Range

BIPOLAR

TEN

0 V to 5 V

Low

Low

0 V to 10 V

Low

High

±5 V

High

Low

±10 V

High

High

31

RD

DI

Read Data. When CS and RD are both low, the interface parallel or serial output bus is enabled.

32

CS

DI

Chip Select. When CS and RD are both low, the interface parallel or serial output bus is enabled. CS is also

used to gate the external clock in slave serial mode (not used for serial programmable port).

33

RESET

DI

Reset Input. When high, reset the AD7610. Current conversion, if any, is aborted. The falling edge of RESET

resets the data outputs to all zero’s (with OB/2C = high) and clears the configuration register. See the

Digital

Interface section. If not used, this pin can be tied to OGND.

34

PD

DI2

Power-Down Input. When PD = high, power down the ADC. Power consumption is reduced and conversions

are inhibited after the current one is completed. The digital interface remains active during power down.

35

CNVST

DI

Conversion Start. A falling edge on CNVST puts the internal sample-and-hold into the hold state and initiates

a conversion.

36

BIPOLAR

DI2

Input Range Select. See description for Pin 30.

37

REF

AI/O

Reference Input/Output. When PDREF/PDBUF = low, the internal reference and buffer are enabled, producing 5 V

on this pin. When PDREF/PDBUF = high, the internal reference and buffer are disabled, allowing an externally

supplied voltage reference up to AVDD volts. Decoupling with at least a 22 μF is required with or without the

internal reference and buffer. See the

Reference Decoupling section.

38

REFGND

AI

Reference Input Analog Ground. Connected to analog ground plane.

39

IN−

AI

Analog Input Ground Sense. Should be connected to the analog ground plane or to a remote sense ground.

40

VCC

P

High Voltage Positive Supply. Normally +7 V to +15 V.

41

VEE

P

High Voltage Negative Supply. Normally 0 V to −15 V (0 V in unipolar ranges).

43

IN+

AI

Analog Input. Referenced to IN−.

45

TEMP

AO

Temperature Sensor Analog Output. Enabled when the internal reference is turned on (PDREF = PDBUF =

low). See the

Temperature Sensor section.

46

REFBUFIN

AI

Reference Buffer Input. When using an external reference with the internal reference buffer (PDBUF = low,

PDREF = high), applying 2.5 V on this pin produces 5 V on the REF pin. See the

Voltage Reference Input section.

47

PDREF

DI

Internal Reference Power-Down Input.

When low, the internal reference is enabled.

When high, the internal reference is powered down, and an external reference must be used.

48

PDBUF

DI

Internal Reference Buffer Power-Down Input.

When low, the buffer is enabled (must be low when using internal reference).

When high, the buffer is powered-down.

49

EPAD3

NC

Exposed Pad. The exposed pad is not connected internally. It is recommended that the pad be soldered

to VEE.

1

AI = analog input; AI/O = bidirectional analog; AO = analog output; DI = digital input; DI/O = bidirectional digital; DO = digital output; P = power.

Hardware Configuration section and Software Configuration section.

3

LFCSP_VQ package only.